How do I get CHIPS Act Funding?

R&D Funding Opportunities

Background

This is an SBIR (small business innovation research opportunity) via the CHIPS Act
Funding: Phase I - Up to $280k over 6 months, Phase II: up to $1.9 million over 2 yrs. Applicants must apply for both phases. An additional $100k may be available for commercialization after.
If you already won an SBIR phase I grant from another agency in a covered topic, you can apply for phase II funding as part of this opportunity.
Applicants must be small businesses defined here (fewer than 500 employees etc.)
Be aware the government can own some IP rights when you accept SBIR funding
Deadline is June 14, 2024

Research Areas (see pp. 80-85 here)

Metrology for Materials Purity, Properties, and Provenance
Advanced Metrology for Future Microelectronics Manufacturing
Enabling Metrology for Integrating Components in Advanced Packaging (e.g. Methods for integrating chiplets, dielets, SoCs, and memories into packages )
Modeling and Simulating Semiconductor Materials, Designs, and Components
Modeling and Simulating Semiconductor Manufacturing Processes
Standardizing New Materials, Processes and Equipment for Microelectronics
Metrology to Enhance Security and Provenance of Microelectronic-based Components and Product

Additional Specific Research Areas (see pp. 85-99 here)

Near-Real Time RF Propagation Measurement System
Compact, fieldable cryogenics for deployment of superconducting-nanowire single-photon detectors in a circuit-evaluation microscope
Microscope for time-resolved emission microscopy with superconducting-nanowire single-photon detectors
Device-Scale AFM-Thermoreflectance Hybrid Metrology
Super-resolution beam scanning, wide bandwidth, optical photothermal infrared (O-PTIR) microscope
High brightness compact X-ray or EUV sources for semiconductor metrology
Nanoscale dimensional metrology reference standards to support semiconductor metrology
Advanced Electron Backscatter Diffraction (EBSD) detector offering high pixel density, high-speed and low noise operation, and low kV detection enabled by directly detecting electrons using an application specific integrated circuit (ASIC) detector.
TEM High Voltage Biasing Holder
Wafer-scale ferromagnetic resonance spectrometer for Advanced MRAM Wafer Data and Quality Control

I'm a Fab or Packaging Facility

Register with SAM
File a statement of interest via the application portal
File a pre-application based on these requirements. Also see the application materials tab for templates etc.
Government will advise based on the pre-application whether to pursue a full application
Need help? Contact our expert grant writing team here.

I'm an Upstream Supplier

Currently open to wafer manufacturers, and to suppliers of materials or equipment for which the capital investment exceeds $300MM+.
Register with SAM
File a statement of interest via the application portal
File a pre-application based on these requirements on or after Sept. 1. See the "application materials" tab on this website for templates etc.
For smaller projects (<$300MM) file a 15-page concept plan between Dec. 1 and Feb. 1 consistent with these guidelines
Need help? Contact our expert grant writing team here

I'm Fabless

Application details for R&D facilities are starting to be released. In the meantime:
Register with SAM
File a statement of interest via the application portal
Work with local government to line up the required project incentive (e.g., tax break, land concession etc.)
Need help? Contact our expert grant writing team here.

I'm in Wireless Technology

I Just Want the Tax Credit

The proposed rules for the 25% refundable manufacturing tax credit are available here, here and here.
Property must be used "used directly in the manufacturing operation" to qualify for the credit.
Contact us for more information: equity@chipsact.com

I Make PCBs or Packaging

In addition to CHIPS Act funding, the President has made funds available under Title III of the Defense Production Act.
Read the press release here and contact us for more information: equity@chipsact.com

I'm an Educational Institution

Businesses submitting grant proposals must partner with educational entities to provide workforce training, so seek corporate partners.
The National Science Foundation gets $200MM to promote growth in the semiconductor workforce
$2 billion is available for a DOD led national network for university-based prototyping, lab-to-fab transition of semiconductor technologies and semiconductor workforce training
Contact us for more information: equity@chipsact.com

I'm a Startup

Some of the $11 billion in R&D funding will go toward an investment fund. Details on the size and eligibility are yet to be released.
Startups should also look to partner with fabs because as part of their application they must show efforts to invest in R&D
Contact us for more information: equity@chipsact.com

I want to Join a Tech Hub

Both DOD and the Commerce Department have designated certain areas as Tech Hubs
Once designated, these Hubs have the opportunity to compete for funding by submitting project proposals featuring participating businesses, academic institutions etc.
Each Hub has a different focus area (e.g., AI, GaN, quantum etc.). Businesses should contact the Hub most appropriate for them, geographic area usually doesn't matter.
A list of Commerce Dept. Hubs is here. DOD's Microelectronics Commons HUB list is here.
The DOD hub funding opportunities are available here.
The Commerce Hub funding notice is open and available here.

White paper for the $3 billion National Advanced Packaging Manufacturing Program. The first funding round, focused on substrate materials, will open Q1'24

Text of The CHIPS Act of 2022 as passed by Congress on 7/28/22 and sent to the President for signature

Text of the FY21 National Defense Authorization Act, authorizing appropriations for the CHIPS Act program P.L. 116-283 (See sections 9902 and 9906)

The Commerce Department's National Security Guardrails for CHIPS funding recipients (i.e., rules restricting grantees from doing business with certain foreign countries)