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How do I get CHIPS Act Funding?
The CHIPS Act makes $53 billion available for semiconductor manufacturing and R&D, plus a 25% refundable tax credit for qualified CapEx.
See below to discover where your business fits in
![Flag of USA on a processor, CPU Central processing Unit or GPU microchip on a motherboard.](https://static.wixstatic.com/media/2c0542_a4668615904a4e44a35ccb0babdd0e13~mv2.jpg/v1/fill/w_491,h_328,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/2c0542_a4668615904a4e44a35ccb0babdd0e13~mv2.jpg)
![Researcher](https://static.wixstatic.com/media/11062b_80e8f53d436f4d2289f16711cde7db9d~mv2.jpeg/v1/fill/w_489,h_275,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/11062b_80e8f53d436f4d2289f16711cde7db9d~mv2.jpeg)
Current R&D Funding Opportunities
ADVANCED PACKAGING
General:
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Total of $1.6 billion available. Individual grants to range from $10MM-$150MM.
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Cost share encouraged, but not required
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Deadline: A 10 page concept paper is due Dec. 20, 2024. (See pp. 117-120 for format). To submit, you must be registered in SAM.gov
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Based on the concept paper, selected proposers will be invited to submit a full application due 60 days later.
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Webinars will be posted with more information.
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A proposers day will be held on October 22 (tomorrow). To attend register here. Webinars will also be posted publicly. Participation is NOT required to apply
Topic Areas:
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Equipment, Tools, Processes, and Process Integration (see pp. 19-35)
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Power Delivery and Thermal Management (see p. 36-47)
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Connector Technology, Including Photonics and Radio Frequency (RF)(see pp. 48-57)
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Chiplets Ecosystem (see pp. 57-75)
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Co-design/Electronic Design Automation (EDA) (see pp. 76-94)
Make an appointment with our expert grant writing team here!
Other Funding Opportunities
![Computer Processor](https://static.wixstatic.com/media/11062b_efb1b630b7f34fc69c3bd82d90b60339~mv2.jpg/v1/crop/x_648,y_0,w_2592,h_2592/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/Computer%20Processor.jpg)
I'm a Fab or Packaging Facility
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Register with SAM
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File a statement of interest via the application portal
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File a pre-application based on these requirements. Also see the application materials tab for templates etc.
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Government will advise based on the pre-application whether to pursue a full application
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Need help? Contact our expert grant writing team here.
![Computer Robot](https://static.wixstatic.com/media/0eebd11a42f44a168f8e6f0a1266b7ca.jpg/v1/crop/x_1444,y_0,w_3112,h_3112/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/Computer%20Robot.jpg)
I'm an Upstream Supplier
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Currently open to wafer manufacturers, and to suppliers of materials or equipment for which the capital investment exceeds $300MM+.
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Register with SAM
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File a statement of interest via the application portal
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File a pre-application based on these requirements on or after Sept. 1. See the "application materials" tab on this website for templates etc.
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For smaller projects (<$300MM) file a 15-page concept plan between Dec. 1 and Feb. 1 consistent with these guidelines
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Need help? Contact our expert grant writing team here​
![Chip Probing](https://static.wixstatic.com/media/0f0a8b34f2f543bdb8a5dc8827d7cbf7.jpg/v1/crop/x_1089,y_0,w_3006,h_3006/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/Chip%20Probing.jpg)
I'm Fabless
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Application details for R&D facilities are starting to be released. In the meantime:
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Register with SAM
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File a statement of interest via the application portal
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Work with local government to line up the required project incentive (e.g., tax break, land concession etc.)
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Need help? Contact our expert grant writing team here​.
![Communication Tower](https://static.wixstatic.com/media/11062b_cc8450587aef4eec938361e7206bc38a~mv2.jpg/v1/crop/x_832,y_0,w_3264,h_3264/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/Communication%20Tower.jpg)
I'm in Wireless Technology
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The CHIPS Act makes $1.5 billion available for wireless supply chain innovation
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Now accepting applications for up to $420MM for Open Radio Commercialization and Innovation
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Application details are available here:
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Deadline: July 10, 2024
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Contact us for more information: equity@chipsact.com
![Image by Kelly Sikkema](https://static.wixstatic.com/media/nsplsh_1cd43e362e7043e3ba3f7a30a7278818~mv2.jpg/v1/crop/x_738,y_0,w_3490,h_3490/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/Image%20by%20Kelly%20Sikkema.jpg)
I Just Want the Tax Credit
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The final rule for the 25% refundable manufacturing is available here.
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Property must be used "used directly in the manufacturing operation" to qualify for the credit.
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Contact us for more information: equity@chipsact.com
![Microchip](https://static.wixstatic.com/media/12d13757d72641eb8e34647f7bf15b25.jpg/v1/crop/x_513,y_0,w_2010,h_2010/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/Microchip.jpg)
I Make PCBs or Packaging
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In addition to CHIPS Act funding, the President has made funds available under Title III of the Defense Production Act.
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Read the press release here and contact us for more information: equity@chipsact.com
![University Building](https://static.wixstatic.com/media/6989199d5af42d5fefc36f977475adbe.jpg/v1/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/University%20Building.jpg)
I'm an Educational Institution
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Businesses submitting grant proposals must partner with educational entities to provide workforce training, so seek corporate partners.
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The National Science Foundation gets $200MM to promote growth in the semiconductor workforce
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$2 billion is available for a DOD led national network for university-based prototyping, lab-to-fab transition of semiconductor technologies and semiconductor workforce training
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Contact us for more information: equity@chipsact.com
![In a Meeting](https://static.wixstatic.com/media/561197a90e6d4a6bb1cf92609952eb46.jpg/v1/crop/x_915,y_0,w_3671,h_3671/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/In%20a%20Meeting.jpg)
I'm a Startup
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Some of the $11 billion in R&D funding will go toward an investment fund. Details on the size and eligibility are yet to be released.
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Startups should also look to partner with fabs because as part of their application they must show efforts to invest in R&D
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Contact us for more information: equity@chipsact.com
![City Skyline](https://static.wixstatic.com/media/73f64659826942c7bfd3e9deeeb6a8e7.jpg/v1/crop/x_912,y_0,w_3648,h_3648/fill/w_120,h_120,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/City%20Skyline.jpg)
I want to Join a Tech Hub
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Both DOD and the Commerce Department have designated certain areas as Tech Hubs
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Once designated, these Hubs have the opportunity to compete for funding by submitting project proposals featuring participating businesses, academic institutions etc.
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Each Hub has a different focus area (e.g., AI, GaN, quantum etc.). Businesses should contact the Hub most appropriate for them, geographic area usually doesn't matter.
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A list of Commerce Dept. Hubs is here. DOD's Microelectronics Commons HUB list is here.
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The DOD hub funding opportunities are available here.
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The Commerce Hub funding notice is open and available here.
Key Documents
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White paper for the $3 billion National Advanced Packaging Manufacturing Program. The first funding round, focused on substrate materials, will open Q1'24
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Text of The CHIPS Act of 2022 as passed by Congress on 7/28/22 and sent to the President for signature
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Text of the FY21 National Defense Authorization Act, authorizing appropriations for the CHIPS Act program P.L. 116-283 (See sections 9902 and 9906) ​​
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The Commerce Department's National Security Guardrails for CHIPS funding recipients (i.e., rules restricting grantees from doing business with certain foreign countries)
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The Commerce Department's Vision for the National Semiconductor Technology Center and summary fact sheet
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Email: equity@chipsact.com