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How do I get CHIPS Act Funding? 

The CHIPS Act makes $53 billion available for semiconductor manufacturing and R&D, plus a 25% refundable tax credit for qualified CapEx.

See below to discover where your business fits in

 

Flag of USA on a processor, CPU Central processing Unit or GPU microchip on a motherboard.
Researcher

Current R&D Funding Opportunities

ADVANCED PACKAGING

General:

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  • Total of $1.6 billion available. Individual grants to range from $10MM-$150MM. 

  • Cost share encouraged, but not required

  • Deadline: A 10 page concept paper is due Dec. 20, 2024. (See pp. 117-120 for format). To submit, you must be registered in SAM.gov

  • Based on the concept paper, selected proposers will be invited to submit a full application due 60 days later.

  • Webinars will be posted with more information. 

  • A proposers day will be held on October 22 (tomorrow). To attend register here. Webinars will also be posted publicly. Participation is NOT required to apply

 

Topic Areas:

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  1. Equipment, Tools, Processes, and Process Integration (see pp. 19-35)

  2. Power Delivery and Thermal Management (see p. 36-47)

  3. Connector Technology, Including Photonics and Radio Frequency (RF)(see pp. 48-57)

  4. Chiplets Ecosystem (see pp. 57-75)

  5. Co-design/Electronic Design Automation (EDA) (see pp. 76-94)

 

Make an appointment with our expert grant writing team here! 

Other Funding Opportunities

Computer Processor

I'm a Fab or Packaging Facility

  • Register with SAM

  • File a statement of interest via the application portal

  • File a pre-application based on these requirements. Also see the application materials tab for templates etc. 

  • Government will advise based on the pre-application whether to pursue a full application

  • Need help? Contact our expert grant writing team here. 

Computer Robot

I'm an Upstream Supplier

  • Currently open to wafer manufacturers, and to suppliers of materials or equipment for which the capital investment exceeds $300MM+.  

  • Register with SAM

  • File a statement of interest via the application portal

  • File a pre-application based on these  requirements on or after Sept. 1. See the "application materials" tab on this website for templates etc. 

  • For smaller projects (<$300MM) file a 15-page concept plan between Dec. 1 and Feb. 1 consistent with these guidelines

  • Need help? Contact our expert grant writing team here​  

Chip Probing

I'm Fabless

  • Application details for R&D facilities are starting to be released. In the meantime:

  • Register with SAM

  • File a statement of interest via the application portal

  • Work with local government to line up the required project incentive (e.g., tax break, land concession etc.)

  • Need help? Contact our expert grant writing team here​.  

Communication Tower

I'm in Wireless Technology

  • The CHIPS Act makes $1.5 billion available for wireless supply chain innovation

  • Now accepting applications for up to $420MM for Open Radio Commercialization and Innovation

  • Application details are available here: 

  • Deadline: July 10, 2024

  • Contact us for more information: equity@chipsact.com

Image by Kelly Sikkema

I Just Want the Tax Credit

  • The final rule for the 25% refundable manufacturing is available here. 

  • Property must be used "used directly in the manufacturing operation" to qualify for the credit.

  • Contact us for more information: equity@chipsact.com

Microchip

I Make PCBs or Packaging

  • In addition to CHIPS Act funding, the President has made funds available under Title III of the Defense Production Act.

  • Read the press release here and contact us for more information: equity@chipsact.com

University Building

I'm an Educational Institution

  • Businesses submitting grant proposals must partner with educational entities to provide workforce training, so seek corporate partners. 

  • The National Science Foundation gets $200MM to promote growth in the semiconductor workforce

  • $2 billion is available for a DOD led national network for university-based prototyping, lab-to-fab transition of semiconductor technologies and semiconductor workforce training

  • Contact us for more information: equity@chipsact.com

In a Meeting

I'm a Startup

  • Some of the $11 billion in R&D funding will go toward an investment fund. Details on the size and eligibility are yet to be released. 

  • Startups should also look to partner with fabs because as part of their application they must show efforts to invest in R&D 

  • Contact us for more information: equity@chipsact.com

City Skyline

I want to Join a Tech Hub

  • Both DOD and the Commerce Department have designated certain areas as Tech Hubs

  • Once designated, these Hubs have the opportunity to compete for funding by submitting project proposals featuring participating businesses, academic institutions etc. 

  • Each Hub has a different focus area (e.g., AI, GaN, quantum etc.). Businesses should contact the Hub most appropriate for them, geographic area usually doesn't matter.

  • A list of Commerce Dept. Hubs is here. DOD's Microelectronics Commons HUB list is here. 

  • The DOD hub funding opportunities are available here.

  • The Commerce Hub funding notice is open and available here.

Key Documents
 

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  • White paper for the $3 billion National Advanced Packaging Manufacturing Program. The first funding round, focused on substrate materials, will open Q1'24

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  • Text of The CHIPS Act of 2022 as passed by Congress on 7/28/22 and sent to the President for signature

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  • Text of the FY21 National Defense Authorization Act, authorizing appropriations for the CHIPS Act program P.L. 116-283 (See sections 9902 and   9906) ​​

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  • The Commerce Department's National Security Guardrails for CHIPS funding recipients (i.e., rules restricting grantees from doing business with certain foreign countries)

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Email: equity@chipsact.com

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