How do I get CHIPS Act Funding?
The CHIPS Act makes $53 billion available for semiconductor manufacturing and R&D, plus a 25% refundable tax credit for qualified CapEx.
See below to discover where your business fits in
Current R&D Funding Opportunities
ADVANCED PACKAGING
General:
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Total of $1.6 billion available. Individual grants to range from $10MM-$150MM.
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Cost share encouraged, but not required
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Deadline: A 10 page concept paper is due Dec. 20, 2024. (See pp. 117-120 for format). To submit, you must be registered in SAM.gov
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Based on the concept paper, selected proposers will be invited to submit a full application due 60 days later.
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Webinars will be posted with more information.
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A proposers day will be held on October 22 (tomorrow). To attend register here. Webinars will also be posted publicly. Participation is NOT required to apply
Topic Areas:
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Equipment, Tools, Processes, and Process Integration (see pp. 19-35)
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Power Delivery and Thermal Management (see p. 36-47)
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Connector Technology, Including Photonics and Radio Frequency (RF)(see pp. 48-57)
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Chiplets Ecosystem (see pp. 57-75)
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Co-design/Electronic Design Automation (EDA) (see pp. 76-94)
Make an appointment with our expert grant writing team here!
Other Funding Opportunities
I'm a Fab or Packaging Facility
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Register with SAM
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File a statement of interest via the application portal
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File a pre-application based on these requirements. Also see the application materials tab for templates etc.
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Government will advise based on the pre-application whether to pursue a full application
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Need help? Contact our expert grant writing team here.
I'm an Upstream Supplier
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Currently open to wafer manufacturers, and to suppliers of materials or equipment for which the capital investment exceeds $300MM+.
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Register with SAM
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File a statement of interest via the application portal
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File a pre-application based on these requirements on or after Sept. 1. See the "application materials" tab on this website for templates etc.
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For smaller projects (<$300MM) file a 15-page concept plan between Dec. 1 and Feb. 1 consistent with these guidelines
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Need help? Contact our expert grant writing team here
I'm Fabless
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Application details for R&D facilities are starting to be released. In the meantime:
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Register with SAM
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File a statement of interest via the application portal
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Work with local government to line up the required project incentive (e.g., tax break, land concession etc.)
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Need help? Contact our expert grant writing team here.
I'm in Wireless Technology
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The CHIPS Act makes $1.5 billion available for wireless supply chain innovation
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Now accepting applications for up to $420MM for Open Radio Commercialization and Innovation
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Application details are available here:
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Deadline: July 10, 2024
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Contact us for more information: equity@chipsact.com
I Just Want the Tax Credit
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The final rule for the 25% refundable manufacturing is available here.
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Property must be used "used directly in the manufacturing operation" to qualify for the credit.
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Contact us for more information: equity@chipsact.com
I Make PCBs or Packaging
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In addition to CHIPS Act funding, the President has made funds available under Title III of the Defense Production Act.
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Read the press release here and contact us for more information: equity@chipsact.com
I'm an Educational Institution
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Businesses submitting grant proposals must partner with educational entities to provide workforce training, so seek corporate partners.
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The National Science Foundation gets $200MM to promote growth in the semiconductor workforce
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$2 billion is available for a DOD led national network for university-based prototyping, lab-to-fab transition of semiconductor technologies and semiconductor workforce training
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Contact us for more information: equity@chipsact.com
I'm a Startup
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Some of the $11 billion in R&D funding will go toward an investment fund. Details on the size and eligibility are yet to be released.
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Startups should also look to partner with fabs because as part of their application they must show efforts to invest in R&D
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Contact us for more information: equity@chipsact.com
I want to Join a Tech Hub
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Both DOD and the Commerce Department have designated certain areas as Tech Hubs
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Once designated, these Hubs have the opportunity to compete for funding by submitting project proposals featuring participating businesses, academic institutions etc.
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Each Hub has a different focus area (e.g., AI, GaN, quantum etc.). Businesses should contact the Hub most appropriate for them, geographic area usually doesn't matter.
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A list of Commerce Dept. Hubs is here. DOD's Microelectronics Commons HUB list is here.
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The DOD hub funding opportunities are available here.
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The Commerce Hub funding notice is open and available here.
Key Documents
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White paper for the $3 billion National Advanced Packaging Manufacturing Program. The first funding round, focused on substrate materials, will open Q1'24
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Text of The CHIPS Act of 2022 as passed by Congress on 7/28/22 and sent to the President for signature
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Text of the FY21 National Defense Authorization Act, authorizing appropriations for the CHIPS Act program P.L. 116-283 (See sections 9902 and 9906)
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The Commerce Department's National Security Guardrails for CHIPS funding recipients (i.e., rules restricting grantees from doing business with certain foreign countries)
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The Commerce Department's Vision for the National Semiconductor Technology Center and summary fact sheet
Email: equity@chipsact.com